With strategic planning, HDI technology can cut overall costs compared to standard PCBs, thanks to fewer layers, smaller dimensions, and reduced PCB quantities required.
HDI technology employs via-in-pad and blind-via techniques to bring components closer, shortening signal paths and improving signal integrity.
Microvias offer superior reliability to through-hole vias due to their smaller aspect ratio and better materials, enhancing HDI technology performance.
Through hole via is openings that extend from one side of the circuit board to the other, allowing components like pins, sockets, or other parts to be soldered through them.
A blind via is a hole that connects an outer layer to an inner layer but doesn't traverse the entire PCB. These holes can be created either mechanically or through laser technology.
This is a hole that passes through one or more inner layers, usually created through mechanical drilling.
A Microvia is a blind structure with an aspect ratio of up to 1:1 between the diameter and depth of the hole, with a maximum depth of 0.25 mm measured from the surface to the target pad or plane.
