Advanced PCB and Standard PCB
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Item
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Advanced PCB
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Standard PCB
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Application
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HIGH-END, COMPLEX
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INEXPENSIVE, FAST
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Ideal For
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Industrial equipments, instrumentation, automotive electronics, communication
equipments
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Children's toys, small appliances, home lighting, functional testing, electronic
enthusiasts
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Engineering
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Senior engineer (one file/6 hours)
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mid-level engineer (5 files/hours)
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Production
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individual working panel
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mixed working panel
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Quantity
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≥1 piece
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5,10,15,20,25...pieces
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Material
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Lead-free/Halogen-free
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EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285,
TU862HF
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High speed
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Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13
Series,MW4000,MW2000,TU933
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High Frequency
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Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27
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Other
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Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,
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Surface Finishing
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Spray Tin, Electroless Nickel Gold, Electroless Tin, OSP, Electroless Silver,
Gold Finger, Electroless Hard / Soft Gold, Selective OSP, Electroless Nickel
Palladium Gold
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Ink, Soldermasks
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Meet IPC4101 class B/L, Rohm&Haas, TAIYO, Kuangshun, Meet IPC-SM-840 class T
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Meet IPC4101 class B/L, TAIYO, Kuangshun, Meet IPC-SM-840 class T
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Plating
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PTH (Hole copper thickness≥20um), IPC 3(25um)
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PTH(Hole copper thickness≥18um)
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Soldermask Offset
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±2mil
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±3mil
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Dimensional Deviation
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±0.13mm
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±0.2mm
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Warping Angle
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0.75%
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1%
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Test Method
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A.O.I, Kelvin Four-terminal sensing, Microsection Inspection, Solderability
Test, Impedance Test...
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A.O.I., Fly Probe Testing
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Glass Transition ℃
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>140℃
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>130℃
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Package
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Humidity indicator cards
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None
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Inspection Report
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Inspection report
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None
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Standard
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IPC Class 2, IPC Class 3, Automotive Standard, Customer Standard
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IPC Class 2
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Etched Line
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Forbid to repair tracks(IPC 3, Automotive, Customer Standard)
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-
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Cleanliness
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Cleanliness requirements beyond those of IPC
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Meet IPC standards
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Certification
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UL, ISO9001:2008, ISO14001:2004, ISO/TS16949:2009, RoHS etc.
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UL, ISO9001:2015, RoHS etc.
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Layers
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120L
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2~68L
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Maximum plate thickness
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14mm(551mil)
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10mm(394mil)
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Minimum line width spacing
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internal layer
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2.0mil/2.0mil
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2.2mil/2.2mil
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Outer layer
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2.2/2.2mil
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2.5/2.5mil
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Counterpart
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Same sheet alignment
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±20um
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±25um
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Interlayer alignment
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±4mil
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±5mil
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Maximum copper thickness
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30Oz
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6Oz
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Hole Diameter
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Mechanical drilling
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≥0.1mm(4mil)
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≥0.15mm(6mil)
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Laser drilling
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0.050mm(2mil)
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0.1mm(4mil)
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Maximum Size
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Veneer
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1000mmX600mm
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850mmX570mm
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(Finished size)
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Backplane
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1320mmX600mm
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1250mmX570mm
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Thickness-to-diameter ratio
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Veneer
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28:01:00
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20:01
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(Finished Hole Diameter)
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Backplane
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35:01:00
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25:01:00
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